Products
You path:  Home >> NEWS >> Printed Circuit Board(PCB)Indu...
Printed Circuit Board(PCB)Industry words
Mike  2012-09-10 01:15:12  
1、 卡ã制硱¦Ì¨¨¡¤¡¥ï¼šprinted circuit
2、 卡ã制ço¿¨¨¡¤¡¥ï¼šprinted wiring
3、 卡ã制板：printed board
4、 卡ã制板硱¦Ì¨¨¡¤¡¥ï¼šprinted circuit board (pcb)
5、 卡ã制ço¿¨¨¡¤¡¥æ¿ï¼šprinted wiring board(pwb)
6、 卡ã制塭ƒä»¶ï¼šprinted component
7、 卡ã制掣¤ç‚1：printed contact
8、 卡ã制板¨¨¡ê¡­¨¦¡­ï¼šprinted board assembly
9、 板：board
10、 单¨¦¡é卡ã制板：single-sided printed board(ssb)
11、 双¨¦¡é卡ã制板：double-sided printed board(dsb)
12、 å¡èšå¡À‚卡ã制板：mulitlayer printed board(mlb)
13、 å¡èšå¡À‚卡ã制硱¦Ì¨¨¡¤¡¥æ¿ï¼šmulitlayer printed circuit board
14、 å¡èšå¡À‚卡ã制ço¿¨¨¡¤¡¥æ¿ï¼šmulitlayer prited wiring board
15、 刚怡ì卡ã制板：rigid printed board
16、 刚怡ì单¨¦¡é卡ã制板：rigid single-sided printed borad
17、 刚怡ì双¨¦¡é卡ã制板：rigid double-sided printed borad
18、 刚怡ìå¡èšå¡À‚卡ã制板：rigid multilayer printed board
19、 挠怡ìå¡èšå¡À‚卡ã制板：flexible multilayer printed board
20、 挠怡ì卡ã制板：flexible printed board
21、 挠怡ì单¨¦¡é卡ã制板：flexible single-sided printed board
22、 挠怡ì双¨¦¡é卡ã制板：flexible double-sided printed board
23、 挠怡ì卡ã制硱¦Ì¨¨¡¤¡¥ï¼šflexible printed circuit (fpc)
24、 挠怡ì卡ã制ço¿¨¨¡¤¡¥ï¼šflexible printed wiring
25、 刚怡ì卡ã制板：flex-rigid printed board, rigid-flex printed board
26、 刚怡ì双¨¦¡é卡ã制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
27、 刚怡ìå¡èšå¡À‚卡ã制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、 ¨¦½å13卡ã制板：flush printed board
29、 ¨¦‡¡®å¡Àž¨¨Š¡¥å¡ã制板：metal core printed board
30、 ¨¦‡¡®å¡ÀžåŸo卡ã制板：metal base printed board
31、 å¡èš¨¦‡å¸ƒço¿å¡ã制板：mulit-wiring printed board
32、 ¨¦™¶ç¡°¡¤å¡ã制板：ceramic substrate printed board
33、 å¡¥¼ç¡±¦Ì¨¨ƒ¶å¡ã制板：electroconductive paste printed board
34、 桧¡å¡¡®ç¡±¦Ì¨¨¡¤¡¥æ¿ï¼šmolded circuit board
35、 桧¡åŽ‹å¡ã制板：stamped printed wiring board
36、 ¨¦¡oåoå¡À‚压å¡èšå¡À‚卡ã制板：sequentially-laminated mulitlayer
37、 æ•¡êço¿å¡ã制板：discrete wiring board
38、 å¾®ço¿å¡ã制板：micro wire board
39、 ç¡ì¡¥å¡À‚卡ã制板：buile-up printed board
40、 ç¡ì¡¥å¡À‚å¡èšå¡À‚卡ã制板：build-up mulitlayer printed board (bum)
41、 ç¡ì¡¥å¡À‚挠卡ã制板：build-up flexible printed board
42、 ¨¨¡¡§¨¦¡éå¡À‚合硱¦Ì¨¨¡¤¡¥æ¿ï¼šsurface laminar circuit (slc)
43、 埋塭£¤å‡¸å¡ª¨¨¿žå¡ã制板：b2it printed board
44、 å¡èšå¡À‚¨¨†œåŸo板：multi-layered film substrate(mfs)
45、 å¡À‚¨¦¡ª¡äå¡­¡§å†¡­å¡¥¼¨¦€šå¡èšå¡À‚卡ã制板：alivh multilayer printed board
46、 ¨¨½½¨¨Š¡¥ç¡ë‡æ¿ï¼šchip on board (cob)
47、 埋硱¦Ì¨¦˜»æ¿ï¼šburied resistance board
48、 æ¡¥æ¿ï¼šmother board
49、 å-æ¿ï¼šdaughter board
50、 ¨¨ƒŒæ¿ï¼šbackplane
51、 ¨¨¡ê¸æ¿ï¼šbare board
52、 ¨¦¡±®ç›˜æ¿å¡è1心板：copper-invar-copper board
53、 务§æ€æŒ æ€¡ì板：dynamic flex board
54、 ¨¦™æ€æŒ æ€¡ì板：static flex board
55、 叡¥æ¨C-拼板：break-away planel
56、 硱¦Ì缆：cable
57、挠怡ìæ¡ëå13硱¦Ì缆：flexible flat cable (ffc)
58、 ¨¨¨C„¨¨†œå¼€å¡­3：membrane switch
59、 桤¡¤åˆç¡±¦Ì¨¨¡¤¡¥ï¼šhybrid circuit
60、 厚¨¨†œï¼šthick film
61、 厚¨¨†œç¡±¦Ì¨¨¡¤¡¥ï¼šthick film circuit
62、 ¨¨¨C„¨¨†œï¼šthin film
63、 ¨¨¨C„¨¨†œæ¡¤¡¤åˆç¡±¦Ì¨¨¡¤¡¥ï¼šthin film hybrid circuit
64、 äo¡¯¨¨¿žï¼šinterconnection
65、 å¡¥¼ço¿ï¼šconductor trace line
66、 ¨¦½å13å¡¥¼ço¿ï¼šflush conductor
67、 ä¼ ¨¨¾¡°ço¿ï¼štransmission line
68、 ¨¨¡¤¡§äo¡è：crossover
69、 板¨¨¾1握¯å¡è¡ä：edge-board contact
70、 å¡éžå¼o板：stiffener
71、 åŸoåo•ï¼šsubstrate
72、 åŸo板¨¦¡é：real estate
73、 å¡¥¼ço¿¨¦¡é：conductor side
74、 å¡­ƒä»¶¨¦¡é：component side
75、 焊掣¤¨¦¡é：solder side
76、 卡ã制：printing
77、 罡®æ ¼ï¼šgrid
78、 图彡é：pattern
79、 å¡¥¼ç¡±¦Ì图彡é：conductive pattern
80、 ¨¦žå¡¥¼ç¡±¦Ì图彡é：non-conductive pattern
81、 å-¡ªç¬|：legend
82、 标忡ªï¼šmark
PCBåŸo材ç¡À»¨¨¡¥æ¡À‡ä¸-¨¨‹¡Àæ¨C‡å¡¥1ç¡­¡ì：
 
1、 åŸo材：base material
2、 å¡À‚压板：laminate
3、 ¨¨|†¨¦‡¡®å¡Àžç®¡±åŸo材：metal-clad bade material
4、 ¨¨|†¨¦¡°œç®¡±å¡À‚压板：copper-clad laminate (ccl)
5、 单¨¦¡é¨¨|†¨¦¡°œç®¡±å¡À‚压板：single-sided copper-clad laminate
6、 双¨¦¡é¨¨|†¨¦¡°œç®¡±å¡À‚压板：double-sided copper-clad laminate
7、 å¡èåˆå¡À‚压板：composite laminate
8、 ¨¨¨C„å¡À‚压板：thin laminate
9、 ¨¦‡¡®å¡Àž¨¨Š¡¥¨¨|†¨¦¡°œç®¡±å¡À‚压板：metal core copper-clad laminate
10、 ¨¦‡¡®å¡ÀžåŸo¨¨|†¨¦¡°œå¡À‚压板：metal base copper-clad laminate
11、 挠怡쨨|†¨¦¡°œç®¡±ç»ç¼˜¨¨¨C„¨¨†œï¼šflexible copper-clad dielectric film
12、 åŸo佡°ææ¨C™ï¼šbasis material
13、 ¨¦¡é„æ¦Ì¸ææ¨C™ï¼šprepreg
14、 ç2˜ç»¡°ç¡ë‡ï¼šbonding sheet
15、 ¨¦¡é„æ¦Ì¸ç2˜ç»¡°ç¡ë‡ï¼špreimpregnated bonding sheer
16、 玡¥æ¡ã¡ì玻硯ƒåŸo板：epoxy glass substrate
17、 加成æ3•ç¡±¡§å¡À‚压板：laminate for additive process
18、 ¨¦¡é„制冡­å¡À‚¨¨|†ç®¡±æ¿ï¼šmass lamination panel
19、 冡­å¡À‚¨¨Š¡¥æ¿ï¼šcore material
20、 催匨C板材：catalyzed board ,coated catalyzed laminate
21、 涂¨¨ƒ¶å‚¬åŒ¨Cå¡À‚压板：adhesive-coated catalyzed laminate
22、 涂¨¨ƒ¶æ¡ª å‚¬å¡À‚压板：adhesive-coated uncatalyzed laminate
23、 ç2˜ç»¡°å¡À‚：bonding layer
24、 ç2˜ç»¡°¨¨†œï¼šfilm adhesive
25、 涂¨¨ƒ¶ç2˜å¡ë‚绝缘¨¨¨C„¨¨†œï¼šadhesive coated dielectric film
26、 桪 æ¡±¡¥æ¡¯¡®¨¨ƒ¶ç2˜å¡ë‚¨¨†œï¼šunsupported adhesive film
27、 ¨¨|†ç›¨Cå¡À‚：cover layer (cover lay)
28、 å¡éžå¼o板材：stiffener material
29、 ¨¦¡°œç®¡±¨¦¡é：copper-clad surface
30、 去¨¦¡°œç®¡±¨¦¡é：foil removal surface
31、 å¡À‚压板¨¦¡é：unclad laminate surface
32、 åŸo¨¨†œ¨¦¡é：base film surface
33、 ¨¨ƒ¶ç2˜å¡ë‚¨¦¡é：adhesive faec
34、 原å¡ì‹å¡­¡ëæ¡ä¨¦¡é：plate finish
35、 ç2¡ª¨¦¡é：matt finish
36、 ço¦Ì吡®ï¼šlength wise direction
37、 桧¡å¡®ï¼šcross wise direction
38、 å¡ëa切板：cut to size panel
39、 ¨¦¡­š¨¦†›ço¸¨¨¡ä¡§¨¨|†¨¦¡°œç®¡±æ¿ï¼šphenolic cellulose paper copper-clad laminates(phenolic/paper ccl)
40、 玡¥æ¡ã¡ìço¸¨¨¡ä¡§¨¨|†¨¦¡°œç®¡±æ¿ï¼šepoxide cellulose paper copper-clad laminates (epoxy/paper ccl)
41、 玡¥æ¡ã¡ì玻硯ƒå¸ƒåŸo¨¨|†¨¦¡°œç®¡±æ¿ï¼šepoxide woven glass fabric copper-clad laminates
42、 玡¥æ¡ã¡ì玻硯ƒå¸ƒço¸å¡èåˆ¨¨|†¨¦¡°œç®¡±æ¿ï¼š
     epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43、 玡¥æ¡ã¡ì玻硯ƒå¸ƒçŽ»ç¡¯ƒço¡è绡äå¡èåˆ¨¨|†¨¦¡°œç®¡±æ¿ï¼š
     epoxide non woven/woven glass reinforced copper-clad laminates
44、 ¨¨š¨¦¡­¡¥çŽ»ç¡¯ƒå¸ƒ¨¨|†¨¦¡°œç®¡±æ¿ï¼šployester woven glass fabric copper-clad laminates
45、 ¨¨š¨¦¡­¡ãäoš¨¨ƒo玻硯ƒå¸ƒ¨¨|†¨¦¡°œç®¡±æ¿ï¼špolyimide woven glass fabric copper-clad laminates
46、 双¨¦©¬æ£¤¨¦¡­¡ãäoš¨¨ƒo両ë塪a玡¥æ¡ã¡ì玻硯ƒå¸ƒ¨¨|†¨¦¡°œç®¡±æ¿ï¼š
     bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、 玡¥æ¡ã¡ì合成ço¡è绡ä布¨¨|†¨¦¡°œç®¡±æ¿ï¼šepoxide synthetic fiber fabric copper-clad laminates
48、 ¨¨šå››ä1™çƒ¡¥çŽ»ç¡¯ƒço¡è绡䨨|†¨¦¡°œç®¡±æ¿ï¼šteflon/fiber glass copper-clad laminates
49、 ¨¨¶¡­¨¨¨C„åž‹å¡À‚压板：ultra thin laminate
50、 ¨¦™¶ç¡°¡¤åŸo¨¨|†¨¦¡°œç®¡±æ¿ï¼šceramics base copper-clad laminates
51、 ç¡ä«å¡è¨Cço¿¨¦˜»æŒ¡åž‹¨¨|†¨¦¡°œç®¡±æ¿ï¼šuv blocking copper-clad laminates
 
PCBço¿¨¨¡¤¡¥¨¨®¾¨¨®¡¨¨¡¥æ¡À‡ä¸-¨¨‹¡Àæ¨C‡å¡¥1ç¡­¡ì：
 
1、 原理图：shematic diagram
2、 ¨¦€»¨¨¾¡®å›¾ï¼šlogic diagram
3、 卡ã制ço¿¨¨¡¤¡¥å¸ƒ¨¨®¾ï¼šprinted wire layout
4、 布¨¨®¾æ€»å›¾ï¼šmaster drawing
5、 叡¥åˆ¶¨¦€ æ€¡ì¨¨®¾¨¨®¡ï¼šdesign-for-manufacturability
6、 ¨¨®¡ç®¡ªæœo¨¨¾¡­åŠ©¨¨®¾¨¨®¡ï¼šcomputer-aided design.(cad)
7、 ¨¨®¡ç®¡ªæœo¨¨¾¡­åŠ©åˆ¶¨¦€ ï¼šcomputer-aided manufacturing.(cam)
8、 ¨¨®¡ç®¡ªæœo¨¦›†æˆåˆ¶¨¦€ ï¼šcomputer integrat manufacturing.(cim)
9、 ¨¨®¡ç®¡ªæœo¨¨¾¡­åŠ©å¡¤£¤ç¡§‹ï¼šcomputer-aided engineering.(cae)
10、 ¨¨®¡ç®¡ªæœo¨¨¾¡­åŠ©æ¦Ì‹¨¨¡¥•ï¼šcomputer-aided test.(cat)
11、 硱¦Ìå-¨¨®¾¨¨®¡¨¨‡a务§åŒ¨C：electric design automation .(eda)
12、 塤£¤ç¡§‹¨¨®¾¨¨®¡¨¨‡a务§åŒ¨C：engineering design automaton .(eda2)
13、 组¨¨¡ê¡­¨¨®¾¨¨®¡¨¨‡a务§åŒ¨C：assembly aided architectural design. (aaad)
14、 ¨¨®¡ç®¡ªæœo¨¨¾¡­åŠ©åˆ¶å›¾ï¼šcomputer aided drawing
15、 ¨¨®¡ç®¡ªæœo採ì制显ç¡èo：computer controlled display .(ccd)
16、 布å¡À€ï¼šplacement
17、 布ço¿ï¼šrouting
18、 布图¨¨®¾¨¨®¡ï¼šlayout
19、 ¨¦‡å¸ƒï¼šrerouting
20、 桧¡æ‹Ÿï¼šsimulation
21、 ¨¦€»¨¨¾¡®æ¡§¡æ‹Ÿï¼šlogic simulation
22、 硱¦Ì¨¨¡¤¡¥æ¡§¡æ‹Ÿï¼šcircit simulation
23、 桪¶åoæ¡§¡æ‹Ÿï¼štiming simulation
24、 桧¡å¡ªåŒ¨C：modularization
25、 布ço¿å®ŒæˆçŽ‡ï¼šlayout effeciency
26、 æœo噡§æ¨¨¿¡ã格式：machine descriptionm format .(mdf)
27、 æœo噡§æ¨¨¿¡ã格式敡ã据åo¡°ï¼šmdf databse
28、 ¨¨®¾¨¨®¡æ•¡ã据åo¡°ï¼šdesign database
29、 ¨¨®¾¨¨®¡åŽŸç‚1：design origin
30、 优匨C（¨¨®¾¨¨®¡ï¼¡ë：optimization (design)
31、 ä¾›¨¨®¾¨¨®¡ä¼˜åŒ¨C坐标¨¨½¡ä：predominant axis
32、 ¨¨¡¡§æ ¼åŽŸç‚1：table origin
33、 ¨¦•œåƒï¼šmirroring
34、 ¨¦©¡À务§æ¨C‡ä»¶ï¼šdrive file
35、 ä¸-¨¦¡ª¡äæ¨C‡ä»¶ï¼šintermediate file
36、 制¨¦€ æ¨C‡ä»¶ï¼šmanufacturing documentation
37、 ¨¦˜Ÿåˆ¡ªæ¡±¡¥æ¡¯¡®æ•¡ã据åo¡°ï¼šqueue support database
38、 å¡­ƒä»¶å®¡ë置：component positioning
39、 图彡é显ç¡èo：graphics dispaly
40、 æ¡¥¡±ä¾‹å› å-ï¼šscaling factor
41、 æ¡ë«æå¡«å¡­¡­ï¼šscan filling
42、 矩彡éå¡«å¡­¡­ï¼šrectangle filling
43、 å¡«å¡­¡­åŸŸï¼šregion filling
44、 实佡°¨¨®¾¨¨®¡ï¼šphysical design
45、 ¨¦€»¨¨¾¡®¨¨®¾¨¨®¡ï¼šlogic design
46、 ¨¦€»¨¨¾¡®ç¡±¦Ì¨¨¡¤¡¥ï¼šlogic circuit
47、 å¡À‚次¨¨®¾¨¨®¡ï¼šhierarchical design
48、 ¨¨‡a¨¦¡¶å¡®ä¸‹¨¨®¾¨¨®¡ï¼štop-down design
49、 ¨¨‡aåo•å¡®ä¸Š¨¨®¾¨¨®¡ï¼šbottom-up design
50、 ço¿ç½¡®ï¼šnet
51、 æ•¡ãå-¡ªåŒ¨C：digitzing
52、 ¨¨®¾¨¨®¡¨¨¡ì„则æ¡ê€æŸ£¤ï¼šdesign rule checking
53、 ¨¨¦Ì¡ã（布Ａëço¿å™¡§ï¼šrouter (cad)
54、 罡®ç»œ¨¨¡¡§ï¼šnet list
55、 ¨¨®¡ç®¡ªæœo¨¨¾¡­åŠ©ç¡±¦Ì¨¨¡¤¡¥åˆ†æžï¼šcomputer-aided circuit analysis
56、 å-ço¿ç½¡®ï¼šsubnet
57、 目标函敡ã：objective function
58、 ¨¨®¾¨¨®¡åŽå¡è„理：post design processing (pdp)
59、 äo¡èäo¡¯å¼åˆ¶å›¾¨¨®¾¨¨®¡ï¼šinteractive drawing design
60、 ¨¨¡ä1硱¡§çŸ©¨¦˜¦Ì：cost metrix
61、 塤£¤ç¡§‹å›¾ï¼šengineering drawing
62、 æ¨C1坡ªæ¡†å›¾ï¼šblock diagram
63、 ¨¨¿¡¤å®«ï¼šmoze
64、 å¡­ƒä»¶å¡¥†åo|：component density
65、 塤¡å›žå¡±®¨¨¡ä¡ìå¡®˜¨¦¡ª®¨¦¡é˜ï¼štraveling salesman problem
66、 ¨¨‡a硱¡Àåo|：degrees freedom
67、 å¡­£¤åo|：out going degree
68、 å‡oåo|：incoming degree
69、 曼塰ˆ¨¦¡¿¨¨¡¤ç|»ï¼šmanhatton distance
70、 次ì几¨¦‡Œå¾¡¤¨¨¡¤ç|»ï¼šeuclidean distance
71、 罡®ç»œï¼šnetwork
72、 ¨¦˜¦Ì刡ªï¼šarray
73、 殦Ì：segment
74、 ¨¦€»¨¨¾¡®ï¼šlogic
75、 ¨¦€»¨¨¾¡®¨¨®¾¨¨®¡¨¨‡a务§åŒ¨C：logic design automation
76、 分ço¿ï¼šseparated time
77、 分å¡À‚：separated layer
78、 定¨¦¡oåoï¼šdefinite sequence
[Print]  [Close]  
Prev: Printed Circuit Board Manufact...
Next: Japanese PCB Makers Facing Tou...

Copyright© Shenzhen Longtech Electronics Co., Ltd    led t8 tubes light, t8 led tube light,  t8 led tube lighting, led t5 tube light, led tube lights t5, t5 led tubes light, t10 led tube lights, t10 led tubes light Sitemap    LED Tube light,LED Tube lamp,LED Tube Light Manufacturer  

 
 
2503564770
 
375737297
 
ete6688523
 
µã»÷ÕâÀï¸øÎÒ·¢ÏûÏ¢
 
µã»÷ÕâÀï¸øÎÒ·¢ÏûÏ¢